A PROMISE OF QUALITY

With a dedicated profession management committed to Quality, each and every employee of the company is actively involved in ensuring manufacture and supply of the highest quality devices, in accordance with the Company's Policies and confirming to the Quality Management Systems ISO/TS 16949 and ISO 9001, as well to the ISO 14001 Environmental Management System.

The Company operates an eco-sustaining production system under a well documented enlightened Environment Policy. After achieving a CFC free first, in January 2005 we have completed conversion of our processes to Lead Free and RoHS compliant manufacturer of semiconductors.

Quality Policy

  • Continental Device India Limited is committed to provide Semiconductor Devices and Solutions by
  • Delighting its Customers by understanding, meeting and Exceeding their expectations.
  • Institutionalizing Continual Improvement through Quality Management System in all work processes.
  • Looking after the Safety of Employees and Product Safety throughout the organization.

Quality is not just another goal, it is our basic strategy for survival and future growth.

Quality Assurance

CDIL is committed to providing high quality semiconductors to its customers. Device reliability is thoroughly monitored through a wide variety of tests conducted during the various stages of product manufacture. As per industry norms, these are accelerated tests serving to model real world application through boosted temperatures, voltages and other applicable stress tests. The battery of tests as detailed in Table I. provides valuable data on defect trends and product anomalies. Our close interaction with customers provides invaluable feedback as 'field performance data'. A system of 'Failure Analysis' and 'Corrective Action' is in place and rigidly implemented.

At CDIL, quality and reliability are built into the product by rigorous control of all operations encompassing design through customer application support.

Statistical Process Control (SPC)

SPC is used extensively throughout the processing line with PPM programs in place on all product lines. The extensive and increasing degree of automation has resulted in continuous enhancement of process capability (Cp, Cpk) to keep pace with market expectations.

All outgoing products go through "QA-gating" with necessary reprocessing of discrepant material to guarantee specified AOQL. A list of critical QA gates is given in Table II.

Special testing and reliability screening schedules are also run on specific customer requests.

Brief Description of Various Reliability Tests Carried out on CDIL Discrete Devices.

  • High Temperature Storage: Checks for sensitivity to ionic contamination and bond integrity.
  • High Temperature Reverse Bias (HTRB): Checks for inversion layers and channeling phenomena in main blocking junction.
  • Wet High Temperature Reverse Bias (WHTRB): Used to accelerate failure mechanisms caused by moisture penetration in plastic packages and corrosion under bias.
  • Operating Life Test: Durability of device is judged by applying electrical stress and thermal stress due to temperature rise caused by load.
  • Intermittent Operating Life Test: Checks for electrical and mechanical durability of device. Device is alternately heated and cooled. The die bond and wire bond are stressed by thermal fatigue.
  • Pressure Cooker Test: Checks for resistance to moisture penetration. A pressurized vessel is used to force moisture through the packaging medium revealing deficiencies in passivation and possibility of corrosion.
  • Thermal Shock: Excellent test for die-package compatibility.
  • Temperature cycling: Checks for mechanical integrity of packaged device-bond wires, die attach and passivation cracks.
  • Resistance to soldering heat: To detect latent anomalies, which manifest when subjected to heat of soldering.
  • Vibration, variable frequency: Durability against differential vibration is assured. Die bond, wire bond and lead integrity is evaluated.
  • Constant Acceleration Test: Intended to check for different modes of mechanical and structural weakness by exposure to centrifugal force.
  • Mechanical Shock Test: check capability against sudden and abrupt charges produced by rough handing and transportation.
  • Seal Test: Hermeticity check for metal packages.
  • Salt Atmosphere Test: Check for corrosion resistance of package.
  • Robustness of Termination: Lead strength and package integrity is assessed to ensure that device can withstand for forces to be applied while mounting, wiring or operation.
  • Solder Test: Ease in soldering lead wires is determined.